Antenna pattern frame, case of electronic device and mould for manufacturing the same

ABSTRACT

There is provided an antenna pattern frame, including: a radiator that includes an antenna pattern part transmitting and receiving signals and a connection terminal part transmitting and receiving the signals to and from a circuit substrate of an electronic device; and a radiator frame that embeds the antenna pattern part in a case of the electronic device and supports the radiator, the radiator being manufactured by injection molding, wherein the radiator frame forms a guide boss inserted into a manufacturing mould for injection-molding the case of the electronic device in which the radiator is embedded.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the priority of Korean Patent Application No.10-2010-0017246 filed on Feb. 25, 2010, in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an antenna pattern frame, a case of anelectronic device, and a mould for manufacturing the same, and moreparticularly, to an antenna pattern frame having an antenna radiatorformed on the surface thereof so that the antenna radiator is embeddedin a case of an electronic device, a case of an electronic device, and amould for manufacturing the same.

2. Description of the Related Art

Mobile communication terminals, for example, cellular phones, PDAs,navigation devices, notebook computers, or the like, that are used tosupport wireless communication are necessities in modern society. Mobilecommunication terminals are being developed to have functions, such asCDMA, wireless LAN, GSM, DMB, or the like. One of the most importantparts that enable these functions is an antenna.

The antenna used in the mobile communication terminal has devolved froman exterior type antenna such as a rod antenna or a helical antenna toan interior type antenna where an antenna is mounted in the terminal.

There have, however, been problems, in that the exterior type antenna isvulnerable to external impacts and the interior type antenna increasesthe volume of the terminal.

In order to solve the problems, a research to integrate the mobilecommunication terminal and the antenna has been actively conducted.

SUMMARY OF THE INVENTION

An aspect of the present invention provides an antenna pattern framehaving an antenna radiator formed on the surface thereof and a case ofan electronic device in which the antenna radiator is embedded.

Another aspect of the present invention provides a mould formanufacturing an antenna pattern frame and a case of an electronicdevice in which an antenna radiator is embedded.

Another aspect of the present invention reduces an appearance defect bystably fixing an antenna pattern frame to a mould for manufacturing acase of an electronic device when molding the case of the electronicdevice in which an antenna radiator is embedded.

According to an aspect of the present invention, there is provided anantenna pattern frame, including: a radiator that includes an antennapattern part transmitting and receiving signals and a connectionterminal part transmitting and receiving the signals to and from acircuit substrate of an electronic device; and a radiator frame thatembeds the antenna pattern part in a case of the electronic device andsupports the radiator, the radiator being manufactured by injectionmolding, wherein the radiator frame forms a guide boss inserted into amanufacturing mould for injection-molding the case of the electronicdevice in which the radiator is embedded.

The guide boss may include a slot part therein so that it is elasticallysupported and fixed to the manufacturing mould.

The radiator frame includes an introducing hole formed to introduce aresin material when injection-molding the case of the electronic device.

The radiator may include a connection part that is a part of theradiator and connects the antenna pattern part to the connectionterminal part, and the connection part may be formed so that the antennapattern part is formed on one surface of the radiator frame and theconnection terminal part is formed on an opposite surface to the onesurface.

The connection terminal part may contact and support the radiatorsupporting part that is protruded from the opposite surface of the onesurface on which the antenna pattern part of the radiator frame isformed.

According to another aspect of the present invention, there is provideda case of an electronic device, including:

a radiator that includes an antenna pattern part transmitting andreceiving signals and a connection terminal part transmitting andreceiving the signals to and from a circuit substrate of an electronicdevice; a radiator frame including a guide boss that supports and fixesthe radiator and is inserted in the manufacturing mould forinjection-molding the case of the electronic device in which theradiator is embedded, the radiator being manufactured by injectionmolding; and a case frame that covers one surface of the radiator frameto embed the antenna pattern part between the radiator frames.

The guide boss may include a slot part so that it is elasticallysupported and fixed to the manufacturing mould.

The radiator frame may include an introducing hole formed to introduce aresin material when injection-molding the case of the electronic device.

The introducing hole may be formed to integrate a resin materialintroduced through the introducing hole with the guide boss.

The connection part may be formed so that the antenna pattern part isformed on one surface of the radiator frame and the connection terminalpart may be formed on an opposite surface to the one surface.

The connection terminal part may contact and support the radiatorsupporting part that is protruded from the opposite surface of the onesurface on which the antenna pattern part of the radiator frame isformed.

According to another aspect of the present invention, there is provideda mould for manufacturing an antenna pattern frame, including: upper andlower moulds receiving a radiator that includes an antenna pattern parttransmitting and receiving signals, a connection terminal part connectedto a circuit substrate of an electronic device, and a connection partconnecting the antenna pattern part to the connection terminal parts;and when the upper and lower moulds are combined with each other, aresin material introducing part formed in any one of the upper, lower,or upper and lower moulds to introduce a resin material into an innerspace so that the inner space of the upper and lower moulds becomes theradiator frame to embed the antenna pattern part in the case of theelectronic device, wherein the lower mould includes a guide groove sothat the radiator frame includes a guide boss that is inserted into themanufacturing mould for injection-molding the case of the electronicdevice and the radiator is the radiator frame by the inner space.

The lower mould may include a protruding part corresponding to the slotpart in the guide groove to form a slot part in the guide boss.

Any one of the upper, lower, or upper and lower moulds may include aninterrupting boss that prevents the resin material from being introducedin order to form an introducing hole for introducing the resin materialon the antenna pattern frame when the case of the electronic device isinjection-molded.

The inner space of the upper and lower moulds may receive the connectionterminal part and may include a radiator supporting part forming groovein order to form the radiator supporting part supporting the connectionterminal part.

Any one of the upper, lower or upper and lower moulds may be providedwith a compression pin that compresses the connection terminal partdisposed in the radiator supporting part forming groove.

According to another aspect of the present invention, there is provideda mould for manufacturing a case of an electronic device, including:upper and lower moulds that receive a radiator including an antennapattern part transmitting or receiving signals, a radiator including aconnection terminal part contacting a circuit substrate of an electronicdevice, a radiator frame supporting the radiator, and an antenna patternframe including a guide boss formed to be protruded from one surface ofthe radiator frame; when the upper and lower moulds are combined witheach other, a resin material introducing part formed in any one of theupper, lower, or upper and lower moulds to forma case of an electronicdevice by combining the antenna pattern frame with the resin materialdue to the introduction of the resin material in the inner space of theupper and lower moulds; and wherein the lower mould includes a guidegroove formed to insert the guide boss and the antenna pattern frame isthe case of the electronic device by the inner space.

The guide groove may include the guide boss receiving part to fix andsupport the guide boss.

The guide boss receiving part is configured of a variable part having adiameter larger than that of the guide boss and a fixing part having adiameter smaller than that of the variable part.

The variable part may receive the guide boss by being protruded to theupper portion of the lower mould before the guide boss is inserted, andmay be inserted into the guide groove of the lower mould after the guideboss is received.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features and other advantages of thepresent invention will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a perspective view schematically showing a partially cutawaycase of an electronic device, a mobile communication terminal accordingto an exemplary embodiment of the present invention;

FIG. 2 is a perspective view schematically showing a radiator used inmanufacturing an antenna pattern frame according to an exemplaryembodiment of the present invention;

FIG. 3 is a perspective view schematically showing an antenna patternframe according to an exemplary embodiment of the present invention;

FIG. 4 is a rear perspective view of the antenna pattern frame of FIG.3;

FIG. 5A is a schematic cross-sectional view taken along line A-A ofFIGS. 3 and 4;

FIG. 5B is a schematic cross-sectional view showing a shape where aresin material is filled in a mould for manufacturing the antennapattern frame in order to manufacture the antenna pattern frame of FIG.5A;

FIG. 6A is a schematic cross-sectional view showing an antenna patternframe according to another exemplary embodiment of the presentinvention;

FIG. 6B is a schematic cross-sectional view showing a shape where theresin material is filled in a mould for manufacturing the antennapattern frame in order to manufacture the antenna pattern frame of FIG.6A;

FIG. 7A is a schematic cross-sectional view showing an antenna patternframe according to another exemplary embodiment of the presentinvention;

FIG. 7B is a schematic cross-sectional view showing a shape where aresin material is filled in a mould for manufacturing the antennapattern frame in order to manufacture the antenna pattern frame of FIG.7A;

FIG. 8 is an exploded perspective view of a case of an electronicdevice, a mobile communication terminal according to an exemplaryembodiment of the present invention in which the antenna patternradiator is embedded;

FIG. 9 is a schematic diagram showing a method for manufacturing thecase of the electronic device according to an exemplary embodiment ofthe present invention in which the antenna pattern radiator is embedded;and

FIGS. 10A to 13B are schematic cross-sectional views showing a processof inserting the antenna pattern radiator into the mould formanufacturing the electronic device and a shape where the resin materialis filled in order to manufacture the case of the electronic deviceaccording to the first through fourth embodiments of the presentinvention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Exemplary embodiments of the present invention will now be described indetail with reference to the accompanying drawings. However, it shouldbe noted that the spirit of the present invention is not limited to theembodiments set forth herein and those skilled in the art andunderstanding the present invention can easily accomplish retrogressiveinventions or other embodiments included in the spirit of the presentinvention by the addition, modification, and removal of componentswithin the same spirit, but those are construed as being included in thespirit of the present invention.

Further, throughout the drawings, the same or similar reference numeralswill be used to designate the same components or like components havingthe same functions in the scope of the similar idea.

FIG. 1 is a perspective view schematically showing a partially cutawaycase of an electronic device, a mobile communication terminal accordingto an exemplary embodiment of the present invention, FIG. 2 is aperspective view schematically showing a radiator used in manufacturing.an antenna pattern frame according to an exemplary embodiment of thepresent invention, FIG. 3 is a perspective view schematically showing anantenna pattern frame according to an exemplary embodiment of thepresent invention, and FIG. 4 is a rear perspective view of the antennapattern frame of FIG. 3.

Referring to FIGS. 1 through 4, it can be appreciated that a radiator250 provided with an antenna pattern according to an exemplaryembodiment of the present invention is embedded in a case 110 of amobile communication terminal 100. In order to form the radiator 250provided with the antenna pattern in the inside of the case 110, anantenna pattern frame 200 that forms the radiator 250 provided with theantenna pattern on a radiator frame 230 is needed.

The antenna pattern frame 200 according to an exemplary embodiment ofthe present invention may include the radiator 250 provided with anantenna pattern part 210, a connection terminal part 220, the radiatorframe 230, and a guide boss 240.

The radiator 250 is made of a conductive material such as aluminum,copper, or the like, to receive external signals and to transmit them toa signal processing unit in the electronic device such as the mobilecommunication terminal 100. Further, the radiator 250 may include theantenna pattern part 210 forming a meander line in order to receive theexternal signals of various bands.

The radiator 250 in which the antenna pattern part 210 receiving theexternal signals and the connection terminal part 220 contacting acircuit substrate of the electronic device to transmit the externalsignals to the electronic device are disposed on a different plane maybe provided.

Further, the radiator 250 may be formed to have a three-dimensionalstructure by bending the antenna pattern part 210 and the connectionterminal part 220, respectively, and the antenna pattern part 210 andthe connection terminal part 220 may be bent and connected to each otherby a bending connection part 256.

The bending connection part 256 may configure the antenna pattern part210 and the connection terminal part 220 on a different plane and theconnection terminal part 220 that is not embedded in the case of theelectronic device may be exposed at an opposite surface 210 b of theantenna pattern frame 200.

In other words, the antenna pattern part 210 and the connection terminalpart 220 are bent by the bending connection part 256, such that theradiator 250 may be implemented to have a three-dimensional curvedshape.

In order to support the radiator 250 having the three-dimensional curvedshape, a radiator supporting part 258 may be protruded from the oppositesurface 210 b of the radiator frame 230.

The radiator supporting part 258 may firmly support the connectionterminal part 220 exposed to the opposite surface 210 b and the bendingconnection part 256.

The radiator 250 may be simultaneously formed with guide pin holes 252or contact pin holes 254.

The guide pin hole 252 and the contact pin hole 254 will be describedbelow.

The connection terminal part 220 transmits the received external signalsto the electronic device and may be formed by performing the bending,forming, and drawing processing on a part of the radiator 250.

In addition, after the connection terminal part 220 is separatelymanufactured from the radiator 250, it may be manufactured to connect tothe radiator 250 and may be connected to the terminal 210 of the circuitsubstrate 300.

Meanwhile, the radiator frame 230 may be a three-dimensional structureformed of a flat plane part 231 and a curve part 233 having a curvature.The radiator 250 may be flexible so that it is disposed at the curvedpart 233 of the radiator frame 230.

The radiator frame 230 is an injection structure, the antenna patternpart 210 may be formed on one surface 210 a of the radiator frame 230,and the connection terminal part 220 may be formed on the oppositesurface 210 b of the one surface 210 a.

The radiator frame 230 may embed the antenna pattern in the case 110 ofthe electronic device by bonding the one surface 210 a formed with theantenna pattern part 210 to the inside of the case 110 of the electronicdevice.

In the structure of the radiator 250 embedded in the case 110 of theelectronic device, the antenna pattern part 210 receiving the externalsignals and the connection terminal part 220 transmitting the externalsignals to the electronic device may be formed on a different plane.

The guide boss 240 is formed to be protruded from the opposite surfaceof the one surface 210 a formed with the antenna pattern part 210 of theradiator frame 230 and may be inserted in the manufacturing mould 500(see FIG. 10) for injection-molding the case 120 of the electronicdevice.

The guide boss 240 is inserted into the manufacturing mould 500 (seeFIG. 10) such that it can be stably fixed on the mould, thereby makingit possible to reduce the appearance defect and withstand the highinjection pressure.

FIG. 5A is a schematic cross-sectional view taken along line A-A ofFIGS. 3 and 4, FIG. 5B is a schematic cross-sectional view showing ashape where a resin material is filled in a mould for manufacturing theantenna pattern frame in order to manufacture the antenna pattern frameof FIG. 5A, and FIGS. 6A to 7B are cross-sectional views schematicallyshowing another embodiment.

Referring to FIG. 5A, the antenna pattern frame 200 according to anexemplary embodiment of the present invention may include the radiator250 provided with the antenna pattern part 210, the connection terminalpart 220, the radiator frame 230, and the guide boss 240.

The radiator 250 may be simultaneously provided with the guide pin holes252 or the contact pin holes 254 and is the same as the exemplaryembodiment other than the guide pin hole 252 or the contact pin hole 254and therefore, a description thereof will be described.

The radiator 250 may be disposed with the guide pin 480 of themanufacturing mold 400 when performing the molding and may be formedwith the guide pin holes 252 that prevent the motion of the radiator 250on the radiator frame 230.

In addition, the radiator 250 may be disposed with the contact pin 470of the manufacturing mold 400 when performing the molding and may beformed with the contact pin holes 254 that prevent the motion of theradiator 250 on the radiator frame 230.

The contact pin 470 and the guide pin 480 may be formed on the radiator250 and the radiator frame 230 under the contact pin 470 is filled afterperforming the molding but the radiator frame 230 under the guide pin480 is formed with holes.

The contact pin 470, inserted into the contact pin hole 254 formed onthe radiator 250, serves to prevent a horizontal movement of theradiator 250 in the mould 400 for manufacturing the antenna patternframe 200.

Further, the guide pin 480 inserted into the guide pin hole 252 formedon the radiator 250 serves to prevent a vertical movement of theradiator 250 in the mould 400 for manufacturing the antenna patternframe 200.

Referring to FIG. 5B, the radiator 250 is disposed in the inner space450 of the manufacturing mould 400 after providing the radiator 250.

The inner space 450 is formed when an upper mould 420 and a lower mould410 are combined with each other and the groove formed in the uppermould 420 or the lower mould 410 becomes the inner space 450 by thecombination of the upper mould 420 and the lower mould 410.

When the upper mould 420 and the lower mould 410 are combined with eachother, the radiator 250 may be fixed to the inner space 450 by passingor contacting the guide pin 480, the contact pin 470 or the guide pin480 and the contact pin 470 that are formed in the upper or lower moulds410 and 420, through and to the guide pin hole 252, the contact pin hole254 or the guide pin hole 252 and the contact pin hole 254 that areformed in the antenna pattern part 210.

The inner space 450 is filled with the resin material to form theradiator frame 230 that embeds the antenna pattern part 210 in the case120 of the electronic device.

When the upper and lower moulds are combined with each other, the innerspace 450 of the upper and lower moulds becomes the radiator frame 230so that the antenna pattern part 210 is embedded in the case 120 of theelectronic device to introduce the resin material into the inner space,thereby making it possible to form the resin material introducing part440 in any one of the upper, lower or upper and lower moulds.

The resin material is identically filled at the boundary surface betweenthe radiator 250 and the radiator frame 230, such that the flowing ofthe resin material can be good when putting the radiator frame 230 inthe mould for manufacturing the case 110 of the electronic device inwhich the antenna pattern is embedded and injection-molding the radiatorframe 230.

At this time, the inner space 450 of the upper or lower moulds 410 and420 is formed with a curve part, such that the radiator frame 230 mayhave the curve part.

Further, the inner space 450 of the upper and lower moulds 410 and 420may accommodate the connection terminal part 220 and include theradiator supporting part forming groove 460 to form the radiatorsupporting part 258 supporting the connection terminal part 220.

In addition, the upper, lower or upper and lower moulds 410 and 420 maybe provided with a compression pin 430 that compresses the connectionterminal part 220 disposed in the radiator supporting part forminggroove 460 to closely attach the connection terminal part 220 to theradiator supporting part forming groove 460.

The compression pin 430 may prevent the resin material from beingintroduced under the connection terminal part 220 when the resinmaterial is introduced. When the injection material is covered on a partof the connection terminal part 220, the electrical connection may beunstable, which can be prevented by the compression pin 430.

Further, the lower mould 410 may include a guide groove 490 so that theradiator frame 230 includes the guide boss 240 inserted into themanufacturing mould 400 for injection-molding the case 110 of theelectronic device.

The resin material is also introduced into the guide groove 490, suchthat the antenna pattern frame 200 may include the guide boss 240.

Referring to FIGS. 6A and 6B, the antenna pattern frame 200 according toanother embodiment of the present invention may include a slot part 245in the guide boss 240.

The slot part 245 may be formed to include the protruding partcorresponding to the slot part 245 in the guide groove 490 of the lowermould 410.

The resin material introduced from the resin material introducing part440 is filled in the guide groove 490 by the slot part 245 but is filledin the region other than the protruding part due to the protruding part.

Therefore, the guide boss 240 of the antenna pattern frame 200 includesthe slot part 245 and the slot part 245 serves to elastically supportand fix the manufacturing mould 400 when forming the case 110 of theelectronic device.

Referring to FIGS. 7A and 7B, the antenna pattern frame 200 according toanother embodiment of the present invention may include a small guideboss 240 as compared with the exemplary embodiment.

In order to form the guide boss 240, the lower mould 410 may include thesmall guide groove 490 and the upper mould 420 may be formed with theprotruding part 422 to form the introducing hole 260 that introduces theresin material into the inner space in the mould 500 (see FIG. 12) formanufacturing the case 110 of the electronic device in which theradiator 250 is embedded.

The introduction of the resin material is prevented by the protrudingpart 422 and the antenna pattern frame 200 may be formed with holes.

However, it is to be noted that the protruding part 422 is to form theintroducing hole 260 and is not limited to being formed in the uppermould 420. Therefore, the protruding part 422 may be formed in the lowermould 410.

FIG. 8 is an exploded perspective view of the case of the electronicdevice, the mobile communication terminal according to an exemplaryembodiment of the present invention in which the antenna patternradiator is embedded.

The case 120 of the electronic device according to the exemplaryembodiment of the present invention in which the antenna patternradiator 200 is embedded may include the radiator 250, the radiatorframe 230, and the case frame 120.

The radiator 250 and the radiator frame 230 are described in theexemplary embodiment and therefore, a description thereof will beomitted.

The case frame 120 covers one surface of the radiator frame 230 in whichthe antenna pattern part 210 is formed to embed the antenna pattern part210 between the radiator frames 230.

Further, the radiator frame 230 and the case frame 120 may be integratedwithout a clearly defined boundary therebetween. When viewing the case110 of the electronic device from the rear, the antenna pattern part 210may not be shown and only the connection terminal part 220 may be shown.

The radiator frame 230, the case frame 120, or the radiator frame 230and the case frame 120 may be formed by the injection molding. Inparticular, when the radiator frame 230 and the case frame 120 areformed of a separate injection fixture, the case 120 of the electronicdevice is manufactured by bonding the radiator frame 230 in which theradiator 250 is formed to the case frame 120.

Meanwhile, the case frame 120 is injection-molded in the radiator frame230, such that it may be subjected to a double injection molding. Inother words, the radiator frame 230 is disposed in the mould and is thensubjected to insert injection, thereby making it possible to integratethe radiator frame 230 and the case frame 120.

When the guide pin hole 252 or the contact pin hole 254 formed in theradiator frame 230 is disposed in the mould 500 (see FIG. 10) formanufacturing the case of the electronic device, they are combined withthe guide pin or the contact pin (not shown) formed in the manufacturingmould 500, thereby making it possible to prevent the antenna patternframe 200 from moving in the manufacturing mould 500.

FIG. 9 is a schematic diagram showing a method for manufacturing thecase of the electronic device according to an exemplary embodiment ofthe present invention in which the antenna pattern radiator is embedded.

Referring to FIG. 9, the case frame 120 is a separate injection producthaving a radiator receiving groove 115 in a shape corresponding to theradiator frame 230 and the case 110 of the electronic device in whichthe antenna pattern radiator is embedded by bonding the radiator frame230 to the radiator receiving groove 115 may be manufactured.

An adhesive layer 495 is formed on the surface of the radiator 250 ofthe antenna pattern frame 200.

FIGS. 10 through 13 are schematic cross-sectional views showing aprocess of inserting the antenna pattern radiator into the mould formanufacturing the electronic device and a shape where the resin materialis filled in order to manufacture the case of the electronic deviceaccording to the first through fourth embodiments of the presentinvention.

Referring to FIG. 10, the guide boss 240 of the antenna pattern frame200 is fixed and supported by being inserted into the guide groove 530of the lower mould 510.

The radiator frame 230 is disposed in the mould 500 for manufacturingthe case of the electronic device having an inner space 540accommodating the radiator frame 230 and the resin material isintroduced into the mould, such that the radiator frame 230 isintegrated with the case 110 of the electronic device.

Meanwhile, the radiator frame 230 and the case frame 120 may be formedwithout a clearly defined boundary therebetween.

When the injection of the antenna pattern frame 200 is called theprimary injection and the injection of the case 110 of the electronicdevice is called the secondary injection, the antenna pattern frame 200may be fixed and supported not to move by the guide boss 240 and theguide groove 530 in the secondary injection manufacturing mould 500,even in the secondary injection as in the primary injection.

In other words, the guide boss 240 is inserted into the secondaryinjection mould 500 to serve to fix and support the injection product,that is, the radiator frame 230 so that the injection product canwithstand the high temperature and the high injection pressure.

Further, the inner space 540 of the manufacturing mould 500 may includethe curve forming part 525 so that the case 110 of the electronic devicehas the curve part.

Meanwhile, the mould 500 for manufacturing the case of the electronicdevice that manufactures the case 120 of the electronic device in whichthe antenna pattern is embedded by the secondary injection may form theantenna pattern part 210 receiving the external signals and theconnection terminal part 220 contacting the circuit substrate of theelectronic device on a different plane.

The radiator frame 230 having the radiator 250 is formed in the upper orlower moulds 510 and 520 and the upper and lower moulds 510 and 520 ofthe mould for manufacturing the case of the electronic device and whenthe upper or lower moulds 510 and 520 are combined with each other, thecase of the electronic device may include the resin material introducingpart 530 introducing the resin material into the inner space so that theinner space 540 formed in the mould becomes the case 120 of theelectronic device.

Similar to the radiator 250, the radiator frame 230 is provided with theguide pin hole or the contact pin hole, wherein the guide pin hole orthe contacting hole may be fixed to the guide pin or the contact pinformed in the manufacturing mould 500. This is to prevent the radiatorframe 230 from moving in the manufacturing mould.

Referring to FIG. 11, the guide boss 240 can be easily inserted into theguide groove 530 of the lower mould 510 by the slot part 245 in theguide boss 240 of the antenna pattern frame 200 and then, be fixed andsupported to the outside of the slot part 245 by its elasticity. As aresult, the guide boss 240 has a structure capable of withstanding highinjection pressure.

Referring to FIG. 12, the guide boss 240 of the antenna pattern frame200 is inserted into the guide groove 530 of the lower mould 510 andthen, a space may be formed in a predetermined area of the guide groove530.

The resin material is introduced into the resin inlet 530, such that itis introduced into the introducing hole 260 of the antenna pattern frame200. Thereafter, the resin material may also be filled in the space ofthe guide groove 530.

In this case, since the antenna pattern frame 200 is fixed and supportedby the flowing of the resin material, the guide boss has a structurecapable of withstanding the injection pressure.

Referring to FIG. 13, the guide groove 530 includes a guide bossreceiving part to fix and support the guide boss 240 and the guide bossreceiving part may include a variable part 532 having a diameter largerthan that of the guide boss 240 and a fixing part 534 having a diametersmaller than that of the variable part 532.

The variable part 532 receives the guide boss 240 by being protruded tothe upper portion of the lower mould before the guide boss 240 isinserted and then, is inserted into the guide groove 530 of the lowermould, such that the antenna pattern frame 200 is fixed and supported tothe lower mould 510.

Therefore, the antenna pattern frame 200 may be easily fixed to thelower mould 510 by the guide boss receiving part 530 configured of thevariable part 532 and the fixing part 534 and can withstandhigh-temperature and high-pressure injection liquid.

As set forth above, the antenna pattern frame, the case of theelectronic device, and the mould for manufacturing the same according tothe present invention stably fixes the antenna pattern frame to theinner space of the mould for manufacturing the case of the electronicdevice when molding the case of the electronic device in which theantenna radiator is embedded, thereby making it possible to reduce theappearance defect and to provide a structure withstanding thehigh-temperature and high-pressure injection liquid when performing theinjection molding.

While the present invention has been shown and described in connectionwith the exemplary embodiments, it will be apparent to those skilled inthe art that modifications and variations can be made without departingfrom the spirit and scope of the invention as defined by the appendedclaims.

1-11. (canceled)
 12. A mould for manufacturing an antenna pattern frame,comprising: upper and lower moulds receiving a radiator that includes anantenna pattern part transmitting and receiving signals, a connectionterminal part connected to a circuit substrate of an electronic device,and a connection part connecting the antenna pattern part to theconnection terminal part; and when the upper and lower moulds arecombined with each other, a resin material introducing part formed inany one of the upper, lower, or upper and lower moulds to introduce aresin material into an inner space so that the inner space of the upperand lower moulds becomes the radiator frame to embed the antenna patternpart in the case of the electronic device, wherein the lower mouldincludes a guide groove so that the radiator frame includes a guide bossthat is inserted into the manufacturing mould for injection-molding thecase of the electronic device and the radiator is the radiator frame bythe inner space.
 13. The mould for manufacturing an antenna patternframe of claim 12, wherein the lower mould includes a protruding partcorresponding to the slot part in the guide groove to form a slot partin the guide boss.
 14. The mould for manufacturing an antenna patternframe of claim 12, wherein any one of the upper, lower, or upper andlower moulds includes an interrupting boss that prevents the resinmaterial from being introduced in order to form an introducing hole forintroducing the resin material on the antenna pattern frame when thecase of the electronic device is injection-molded.
 15. The mould formanufacturing an antenna pattern frame of claim 12, wherein the innerspace of the upper and lower moulds receives the connection terminalpart and includes a radiator supporting part forming groove in order toform the radiator supporting part supporting the connection terminalpart.
 16. The mould for manufacturing an antenna pattern frame of claim12, wherein any one of the upper, lower or upper and lower moulds isprovided with a compression pin that compresses the connection terminalpart disposed in the radiator supporting part forming groove.
 17. Amould for manufacturing a case of an electronic device, comprising:upper and lower moulds that receive a radiator including an antennapattern part transmitting or receiving signals, a radiator including aconnection terminal part contacting a circuit substrate of an electronicdevice, a radiator frame supporting the radiator, and an antenna patternframe including a guide boss formed to be protruded from one surface ofthe radiator frame; and when the upper and lower moulds are combinedwith each other, a resin material introducing part formed in any one ofthe upper, lower, or upper and lower moulds to form a case of anelectronic device by combining the antenna pattern frame with the resinmaterial due to the introduction of the resin material in the innerspace of the upper and lower moulds; wherein the lower mould includes aguide groove formed to insert the guide boss and the antenna patternframe is the case of the electronic device by the inner space.
 18. Themould for manufacturing the case of the electronic device of claim 17,wherein the guide groove includes the guide boss receiving part to fixand support the guide boss.
 19. The mould for manufacturing the case ofthe electronic device of claim 18, wherein the guide boss receiving partis configured of a variable part having a diameter larger than that ofthe guide boss and a fixing part having a diameter smaller than that ofthe variable part.
 20. The mould for manufacturing the case of theelectronic device of claim 19, wherein the variable part receives theguide boss by being protruded to the upper portion of the lower mouldbefore the guide boss is inserted, and is inserted into the guide grooveof the lower mould after the guide boss is received.